Bismuth – Copper – Nickel

Iuliia Fartushna, Alexandra Khvan

Introduction

Much effort has been made to the development of new Pb-free solders and brazing materials in the recent years. Bi based alloys with additions of Cu and Ni represent promising lead-free solders for the electronic industry. Bi is the main binding component, so higher processing temperatures can be achieved compared to conventional Sn-based solders. Moreover, these Bi-based solders represent an environmentally friendly alternative with a very high reliability in operation. This makes the phase diagram of the Bi-Cu-Ni ternary system of importance for the understanding of the processes that occur during soldering and during operation of the soldered devices.