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Authors: MSIT
Title: Ag-Al-Cu-Ni-Sn Links to Phase Diagram Literature
Category: Links to Literature
Source: MSI Eureka
Editor: Effenberg, G. (Ed.)
Publisher: MSI, Materials Science International Services GmbH, Stuttgart
Publication year: 2011
Version: 1
Document ID: 60.54842.1.0

Ag-Al-Cu-Ni-Sn Bibliography

[2008Kim13]

Kim, J.-M.; Jung, J.-P.; Zhou, Y.N.; Kim, J.-Y., “Ambient Temperature Ultrasonic Bonding of Si-Dice Using Sn-3.5wt%Ag”, J. Electron. Mater., 37 (3), 324-330 (2008) (Experimental, Morphology, Phase Relations, 25)

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1 reference in total.