Ag-Al-Ce-Cu-Ga-O-Sn-Ti Links to Phase Diagram Literature
Category
Links to Literature
Version No
1
Document ID
60.54831.1.9
Ag-Al-Ce-Cu-Ga-O-Sn-Ti Bibliography
[2007Cha22]
Chang, S.Y.; Chuang, T.H.; Yang, C.L., “Low Temperature Bonding of Alumina/Alumina and Alumina/Copper in Air Using Sn3.5Ag4Ti(Ce,Ga) Filler”, J. Electron. Mater., 36 (9), 1193-1198 (2007) (Experimental, Morphology, 16)
....
1 reference in total.
(c) MSI GmbH, Stuttgart. All rights reserved. Unauthorized copying prohibited.