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Authors: MSIT
Title: Ag-Al-Cu-Ni-Sn-V Links to Phase Diagram Literature
Category: Links to Literature
Source: MSI Eureka
Editor: Effenberg, G. (Ed.)
Publisher: MSI, Materials Science International Services GmbH, Stuttgart
Publication year: 2011
Version: 3
Document ID: 60.54785.3.1

Ag-Al-Cu-Ni-Sn-V Bibliography

[2006Jan11]

Jang, G.-Y.; Duh, J.-G.; Takahashi, H.; Lu, S.-W.; Chen, J.-C., “Influence of Cu Content on Compound Formation near the Chip Side for the Flip-Chip Sn-3.0Ag-(0.5 or 1.5)Cu Solder Bump During Aging”, J. Electron. Mater., 35 (9), 1745-1754 (2006) (Experimental, Mechanical Properties, Morphology, 29)

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3 references in total.