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Authors: MSIT
Title: Ag-Al-Cu-Sn-Zn Links to Phase Diagram Literature
Category: Links to Literature
Source: MSI Eureka
Editor: Effenberg, G. (Ed.)
Publisher: MSI, Materials Science International Services GmbH, Stuttgart
Publication year: 2011
Version: 1
Document ID: 60.53168.1.7

Ag-Al-Cu-Sn-Zn Bibliography

[2004Hua13]

Huang, C.-W.; Lin, K.-L., “Interfacial Reactions of Lead-Free Sn-Zn Based Solders on Cu and Cu Plated Electroless Ni-P/Au Layer Under Aging at 150°C”, J. Mater. Res., 19 (12), 3560-3568 (2004) (Experimental, Interface Phenomena, Kinetics, Morphology, Phase Relations, 22)

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1 reference in total.