MSI, Materials Science International Services GmbH, Stuttgart
Publication year
2011
Version
2
Document ID
60.45533.2.6
Ag-Al-Cu-Sn Bibliography
[2002Lin8]
Lin, K.-L.; Hsiao, Ch.-Ch.; Chen, K., “Microstructural Evolution of Sn-Ag-Cu-Al Solder with Respect to Al Content and Heat Treatment”, J. Mater. Res., 17 (9), 2386-2393 (2002) (Crystal Structure, Experimental, 22)
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2 references in total.
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